| ［1］ZHOU Dejian，et al. Advanced electronic assembly technology[A]. Proceeding of Advanced Manufacturing Technology[C].Beijing:Mechanical Industry Press，1996.318-321（in Chinese）.[周德俭，等.当代先进电子组装技术［A］.全国先进制造技术学术会议论文集［C］.北京：机械工业出版社，1996.318-321.]
[2]HE Yuchen, ZHANG Heming, et al. The key technology and implement modes of DFM[J].Computer Integrated Manufacturing System—CIMS, 2001，7(11):45-49 (in Chinese).[何煜琛,张和明,等.DFM的关键技术与实现模式研究［J］.计算机集成制造系统—CIMS，2001, 7(11):45-49.]
[3]ZHOU Dejian.Study on the solder joint shape theory of SMT and it’s CAD[D].Hangzhou: Zhejiang University,1998(in Chinese).[周德俭.SMT焊点形态理论及其CAD技术研究［D］.杭州：浙江大学，1998.]
[4]PAN Kailin. Study on the solder joint evolving mechanism of SMT and modeling[D].Guilin: Guilin Univ. of Electronic Technology,1998(in Chinese).[潘开林.SMT焊点成形机理分析及建模设计［D］.桂林:桂林电子工业学院，1998.]
[5]ZHOU Dejian, WU Zhaohua, LIU Changkang. Research of SMT solder joint virtual evolving and SMT product virtual mount technology[J]. Computer Integrated Manufacturing System—CIMS,1998，4(5):46-50(in Chinese). [周德俭，吴兆华，刘常康.SMT焊点虚拟成形和SMT产品虚拟组装技术研究［J］.计算机集成制造系统—CIMS，1998，4(5):46-50.]
[6]ZHOU Dejian, CHEN Zichen, WU Zhaohua. Virtual assembly technology of SMT based on solder joint shape theory[J]. Equipment for Electronic Products Manufacturing, 1997,26(4):35-39(in Chinese).［周德俭，陈子辰，吴兆华.基于焊点形态理论的SMT虚拟组装技术［J］.电子工业专用设备，1997,26(4):35-39.]
[7]PAN Kailin,ZHOU Dejian.Study on the prediction and simulation of reflow soldering process of SMT[J].Electronic Process Technology,2000,21(5):125-127(in Chinese).[ 潘开林,周德俭. SMT再流焊接工艺预测与仿真技术研究现状［J］.电子工艺技术, 2000,21(5):125-127.]
|
