关键词: 抛光, 材料去除, 最优行距, 轨迹规划

Abstract: When using the traditional trajectory planning method,it is easy to produce over-polishing or under-polishing because the change of the mechanical properties of the tool-workpiece contact during the polishing process is not considered.For this reason,a new trajectory planning algorithm considering material removal characteristics was proposed.Based on the Hertz theory,the pressure distribution and velocity distribution of the contact area between the spherical polishing tool and the curved surface were obtained.On this Basis,the material removal model of the polishing process was established,and the numerical solution of the optimal line spacing for adjacent polishing tracks was given.The influence of the tool attitude angle on the material removal depth and the results of the trajectory planning algorithm was analyzed,and the line spacing and feed speed were optimized to adapt to the change of the tool attitude angle of adjacent trajectories to avoid under-polishing and over-polishing.Simulation and test results showed that the algorithm could effectively ensure the uniformity of material removal and achieve the desired material removal depth.The surface quality after polishing was better than the isoparametric method.

Key words: polishing, material removal, optimal line spacing, trajectory planning